| HBM3e (36GB 12-Hi) |
SK Hynix |
1.28 TB/s |
85% |
Advanced MR-MUF (Mass Reflow Molded Underfill) |
NVIDIA GB200, B200, H200 |
| HBM4 (48GB 16-Hi) |
SK Hynix |
2 TB/s |
70% |
Custom TSMC Base Die + MR-MUF |
NVIDIA Rubin R100, AMD MI400 |
| HBM3e (36GB 12-Hi Shinebolt) |
Samsung Electronics |
1.28 TB/s |
15% |
Advanced NCF (Non-Conductive Film) |
AMD MI325X, CSP Custom ASICs |
| CXL 2.0 Memory Expander (CMM-D) |
Samsung Electronics |
0.51 TB/s |
60% |
PCIe 5.0 CXL Controller |
Hyperscale Cloud Host Nodes |
| HBM4 (48GB 16-Hi Turnkey) |
Samsung Electronics |
2 TB/s |
30% |
Custom 4nm GAA Base Die + NCF |
Major Hyperscalers & ASICs |
| LPDDR5X CAMM2 Modular AI Memory |
SK Hynix |
0.38 TB/s |
65% |
Low-Power Modular Architecture |
AI PC OEMs & Edge Accelerators |