TSMC CoWoS Advanced Packaging
TSMC • CoWoS-S / CoWoS-L / CoWoS-R
92% Global
Chip-on-Wafer-on-Substrate technology interconnecting high-bandwidth memory (HBM3e) with AI compute logic dies at micro-pitch density.
Primary Clients: NVIDIA, AMD, Broadcom, AWS, Google
TSMC A16 / N2 GAA Process
TSMC • 2nm GAAFET / 1.6nm NanoSheet + SuperPower Rail
88% Global
Next-generation gate-all-around nanosheet transistor architecture delivering 15% speed boost or 30% power reduction.
Primary Clients: Apple, NVIDIA, AMD, Qualcomm
Huawei Ascend 910C Sovereign NPU
Huawei HiSilicon • Domestic Sovereign Packaging
65% Global
China's flagship sovereign AI cluster processor offering high-throughput matrix multiplication for domestic foundation model pre-training.
Primary Clients: China Mobile, China Telecom, State Datacenters
MediaTek Dimensity 9400 GenAI NPU
MediaTek • TSMC 3nm N3E
35% Global
Eighth-generation NPU 890 delivering on-device diffusion video generation and 50 tokens/sec high-speed LLM processing.
Primary Clients: Vivo, Oppo, Xiaomi, Samsung